ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,206, issued on April 8, was assigned to QUALCOMM Inc. (San Diego). "Parameter configuration for configured grant based multi-transmission r... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,888, issued on April 8, was assigned to InterDigital Patent Holdings Inc. (Wilmington, Del.). "Methods and apparatus for wireless transmit/... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,117, issued on April 8, was assigned to BAE Systems Information and Electronic Systems Integration Inc. (Nashua, N.H.). "System and method ... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,805, issued on April 8, was assigned to THE REGENTS OF THE UNIVERSITY OF MICHIGAN (Ann Arbor, Mich.) and The Regents of the University of Ca... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. D1,070,170, issued on April 8, was assigned to APR Beauty Group Inc. (Toronto). "Cosmetic applicator" was invented by Min-Yan Zheng (Richmond Hill... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,270,633, issued on April 8, was assigned to HANWHA Corp. (Seoul, South Korea). "Device and method thereof for determining detonator information... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,268,580, issued on April 8, was assigned to Thinx Inc. (New York). "Technologies for incontinence underwear" was invented by Nirodha Siriwarden... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,597, issued on April 8, was assigned to THE BOEING COMPANY (Arlington, Va.). "Dual track light-limiting header assembly" was invented by Ti... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. D1,069,855, issued on April 8, was assigned to BROTHER INDUSTRIES LTD. (Nagoya, Japan). "Embroidery machine" was invented by Nozomi Tanaka (Nagoya... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,068, issued on April 8, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method and substrate processing devi... Read More